Kazuhisa Arai

According to our database1, Kazuhisa Arai authored at least 2 papers between 2011 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
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Links

On csauthors.net:

Bibliography

2013
Influence of wafer thinning process on backside damage in 3D integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
Development of ultra-thinning technology for logic and memory heterogeneous stack applications.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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