Akira Uedono

According to our database, Akira Uedono authored at least 2 papers between 2013 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects.

Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Son Nguyen, Brown Peethala, Huai Huang, Hosadurga Shobha, Nick Lanzillo, Raghuveer Patlolla, Devika Sil, Andrew Simon, Daniel Edelstein, Nelson Felix, Junjun Liu, Toshiyuki Tabata, Fulvio Mazzamuto, Sebastien Halty, Fabien Rozé, Yasutoshi Okuno, Akira Uedono

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013