Ki Jin Han

According to our database, Ki Jin Han authored at least 12 papers between 2008 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Hyperloop Communications: Unveiling Electromagnetic Propagation in the Hyperloop Tube.

Jeong Tak Kim, Hyoil Kim, Ki Jin Han

IEEE Veh. Technol. Mag., 2022

Frequency-Dependent Bearing Voltage Model for Squirrel-Cage Induction Motors.

Manje Yea, Jingook Kim, Ki Jin Han

IEEE Trans. Ind. Electron., 2022

Adversarial attacks and defenses on AI in medical imaging informatics: A survey.

Sara Kaviani, Ki Jin Han, Insoo Sohn

Expert Syst. Appl., 2022

2021

Stator Impedance Modeling Platform for the Electromagnetic Compatibility Aware Design of 3.7- to 7.5-KW Squirrel-Cage Induction Motors.

Younggon Ryu, Manje Yea, Jingook Kim, Ki Jin Han

IEEE Trans. Ind. Electron., 2021

2020

Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array.

Byungjin Bae, Jingook Kim, Ki Jin Han

IEEE Access, 2020

2019

Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems.

Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang

IEEE Access, 2019

2018

Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study.

Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang

Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018

2017

Review of Near-Field Wireless Power and Communication for Biomedical Applications.

Han-Joon Kim, Hiroshi Hirayama, Sanghoek Kim, Ki Jin Han, Rui Zhang, Ji-Woong Choi

IEEE Access, 2017

2016

Novel Adaptive Power-Gating Strategy and Tapered TSV Structure in Multilayer 3D IC.

Seungwon Kim, Seokhyeong Kang, Ki Jin Han, Youngmin Kim

ACM Trans. Design Autom. Electr. Syst., 2016

2015

Novel adaptive power gating strategy of TSV-based multi-layer 3D IC.

Seungwon Kim, Seokhyung Kang, Ki Jin Han, Youngmin Kim

Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015

2009

Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions.

Ki Jin Han, Madhavan Swaminathan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009

2008

Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects.

Ki Jin Han, Madhavan Swaminathan, Ege Engin

Proceedings of the 45th Design Automation Conference, 2008