Kukjin Chun

According to our database1, Kukjin Chun authored at least 13 papers between 2006 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2020
Multi Image Depth from Defocus Network with Boundary Cue for Dual Aperture Camera.
Proceedings of the 2020 IEEE International Conference on Acoustics, 2020

2019
Lensless Imaging Sensor Kit for Sperm Counting with Microfluidic Chip.
Proceedings of the IEEE Sensors Applications Symposium, 2019

Novel Sperm Sorting Microfluidic Chip With Feedback Channel and Vertical Orientation.
Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019

Plano-Convex Lens Fabrication for Distance Sensor based on Single Vision.
Proceedings of the International Conference on Electronics, Information, and Communication, 2019

2018
Tunable Aperture with Single layer Blades Actuated by Thermal Expansion of Silicon Beams.
Proceedings of the TENCON 2018, 2018

2017
Tunable aperture controlled by thermal expansion of copper beams.
Proceedings of the IEEE AFRICON 2017, Cape Town, South Africa, September 18-20, 2017, 2017

2013
Cantilever arrayed blood pressure sensor for arterial applanation tonometry.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Implantable CNT-based sensor for chondroitin sulfate proteoglycans detection of glial scar after spinal cord injury.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

2011
A 2x2 MIMO Tri-Band Dual-Mode Direct-Conversion CMOS Transceiver for Worldwide WiMAX/WLAN Applications.
IEEE J. Solid State Circuits, 2011

2010
A 2.3GHz linearized CMOS power amplifier with AM-AM and AM-PM distortion correction.
IEICE Electron. Express, 2010

A 2×2 MIMO tri-band dual-mode CMOS transceiver for worldwide WiMAX/WLAN applications.
Proceedings of the 36th European Solid-State Circuits Conference, 2010

2006
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist.
Proceedings of the 2006 International Conference on MEMS, NANO and Smart Systems, 2006

Realistic computational modeling for hybrid biopolymer microcantilevers.
Proceedings of the 28th International Conference of the IEEE Engineering in Medicine and Biology Society, 2006


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