Kyung-Seob Kim

According to our database, Kyung-Seob Kim authored at least 5 papers between 2003 and 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2008

Investigation of relation between intermetallic and tin whisker growths under ambient condition.

Kyung-Seob Kim, C. H. Yu, S. W. Han, K. C. Yang, J. H. Kim

Microelectron. Reliab., 2008

2006

Tin whisker formation of lead-free plated leadframes.

Kyung-Seob Kim, C. H. Yu, J. M. Yang

Microelectron. Reliab., 2006

2005

The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces.

Kyung-Seob Kim, K. W. Ryu, C. H. Yu, J. M. Kim

Microelectron. Reliab., 2005

2004

Fatigue analysis of high-speed photodiode submodule by using FEM.

Kyung-Seob Kim, H. I. Kim, C. H. Yu, E. G. Chang

Microelectron. Reliab., 2004

2003

Isothermal aging characteristics of Sn-Pb micro solder bumps.

Kyung-Seob Kim, C. H. Yu, Nam-Hoon Kim, N. K. Kim, H. J. Chang, E. G. Chang

Microelectron. Reliab., 2003