C. H. Yu

According to our database, C. H. Yu authored at least 7 papers between 2003 and 2015.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2015

An optimized dispersion-relation-preserving combined compact difference scheme to solve advection equations.

C. H. Yu, D. Wang, Zhiguo He, Thomas Pähtz

J. Comput. Phys., 2015

2011

3D stacking using Cu-Cu direct bonding.

Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Investigation of relation between intermetallic and tin whisker growths under ambient condition.

Kyung-Seob Kim, C. H. Yu, S. W. Han, K. C. Yang, J. H. Kim

Microelectron. Reliab., 2008

2006

Tin whisker formation of lead-free plated leadframes.

Kyung-Seob Kim, C. H. Yu, J. M. Yang

Microelectron. Reliab., 2006

2005

The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces.

Kyung-Seob Kim, K. W. Ryu, C. H. Yu, J. M. Kim

Microelectron. Reliab., 2005

2004

Fatigue analysis of high-speed photodiode submodule by using FEM.

Kyung-Seob Kim, H. I. Kim, C. H. Yu, E. G. Chang

Microelectron. Reliab., 2004

2003

Isothermal aging characteristics of Sn-Pb micro solder bumps.

Kyung-Seob Kim, C. H. Yu, Nam-Hoon Kim, N. K. Kim, H. J. Chang, E. G. Chang

Microelectron. Reliab., 2003