Leiming Du

According to our database1, Leiming Du authored at least 1 paper in 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2022
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects.
Proceedings of the IECON 2022, 2022


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