Willem D. van Driel

According to our database1, Willem D. van Driel authored at least 59 papers between 2003 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Uncertainty analysis and interval prediction of LEDs lifetimes.
Reliab. Eng. Syst. Saf., February, 2024

2023
Towards an MLOps Architecture for XAI in Industrial Applications.
CoRR, 2023

Lifetime Prediction of Current-and Temperature-Induced Degradation in Silicone-Encapsulated 365 nm High-Power Light-Emitting Diodes.
IEEE Access, 2023

2022
Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes.
IEEE Access, 2022

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects.
Proceedings of the IECON 2022, 2022

2021
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0).
Proceedings of the 24th Euromicro Conference on Digital System Design, 2021

2018
A stochastic process based reliability prediction method for LED driver.
Reliab. Eng. Syst. Saf., 2018

A review on discoloration and high accelerated testing of optical materials in LED based-products.
Microelectron. Reliab., 2018

2017
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.
Reliab. Eng. Syst. Saf., 2017

Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products.
Microelectron. Reliab., 2017

Color shift acceleration on mid-power LED packages.
Microelectron. Reliab., 2017

2016
Creep fatigue models of solder joints: A critical review.
Microelectron. Reliab., 2016

LED degradation: From component to system.
Microelectron. Reliab., 2016

Lumen maintenance predictions for LED packages.
Microelectron. Reliab., 2016

2015
DEWI - Wirelessly into the Future.
Proceedings of the 2015 Euromicro Conference on Digital System Design, 2015

2014
Multi-physics reliability simulation for solid state lighting drivers.
Microelectron. Reliab., 2014

Accelerated life time testing and optical degradation of remote phosphor plates.
Microelectron. Reliab., 2014

Reliability and optical properties of LED lens plates under high temperature stress.
Microelectron. Reliab., 2014

Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab., 2014

2012
Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach.
IEEE Trans. Signal Process., 2012

An approach to "Design for Reliability" in solid state lighting systems at high temperatures.
Microelectron. Reliab., 2012

2011
Effect of high temperature aging on reliability of automotive electronics.
Microelectron. Reliab., 2011

Local stress analysis on semiconductor devices by combined experimental-numerical procedure.
Microelectron. Reliab., 2011

2010
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.
Sensors, 2010

Reliability modeling on a MOSFET power package based on embedded die technology.
Microelectron. Reliab., 2010

Predictive modeling of board level shock-impact reliability of the HVQFN-family.
Microelectron. Reliab., 2010

A fast moisture sensitivity level qualification method.
Microelectron. Reliab., 2010

Designing for reliability using a new Wafer Level Package structure.
Microelectron. Reliab., 2010

2009
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.
Microelectron. Reliab., 2009

Advances in the drop-impact reliability of solder joints for mobile applications.
Microelectron. Reliab., 2009

Solder-joint reliability of HVQFN-packages subjected to thermal cycling.
Microelectron. Reliab., 2009

Comparing drop impact test method using strain gauge measurements.
Microelectron. Reliab., 2009

2008
Packaging influences on the reliability of MEMS resonators.
Microelectron. Reliab., 2008

The need for multi-scale approaches in Cu/low-k reliability issues.
Microelectron. Reliab., 2008

Correlation studies for component level ball impact shear test and board level drop test.
Microelectron. Reliab., 2008

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.
Microelectron. Reliab., 2008

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
Microelectron. Reliab., 2008

On chip-package stress interaction.
Microelectron. Reliab., 2008

2007
Molecular simulation on the material/interfacial strength of the low-dielectric materials.
Microelectron. Reliab., 2007

Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab., 2007

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectron. Reliab., 2007

On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.
Microelectron. Reliab., 2007

Measuring the through-plane elastic modulus of thin polymer films in situ.
Microelectron. Reliab., 2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.
Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.
Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.
Microelectron. Reliab., 2007

Mechanical reliability challenges for MEMS packages: Capping.
Microelectron. Reliab., 2007

Advanced structural similarity rules for the BGA package family.
Microelectron. Reliab., 2007

Facing the challenge of designing for Cu/low-k reliability.
Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab., 2007

2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectron. Reliab., 2006

Multiscale modelling of multilayer substrates.
Microelectron. Reliab., 2006

Reliability modelling for packages in flexible end-products.
Microelectron. Reliab., 2006

2005
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectron. Reliab., 2005

2004
Prediction of crack growth in IC passivation layers.
Microelectron. Reliab., 2004

Prediction of thermo-mechanical integrity of wafer backend processes.
Microelectron. Reliab., 2004

Characterization and Modelling of Moisture Driven Interface Failures.
Microelectron. Reliab., 2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.
Microelectron. Reliab., 2004

2003
Prediction and verification of process induced warpage of electronic packages.
Microelectron. Reliab., 2003


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