G. Q. Zhang

Affiliations:
  • Delft University of Technology, Delft, The Netherlands


According to our database1, G. Q. Zhang authored at least 87 papers between 2003 and 2021.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2021
Fabrication of Nanoslits with Etching TSWE Method.
Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021

Mastering the Game of Amazons Fast by Decoupling Network Learning.
Proceedings of the International Joint Conference on Neural Networks, 2021

2020
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review.
Entropy, 2020

Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors.
Proceedings of the 29th IEEE International Symposium on Industrial Electronics, 2020

2019
Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group.
CoRR, 2019

A Reliability Prediction Methodology for LED Arrays.
IEEE Access, 2019

Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.
IEEE Access, 2019

Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs.
IEEE Access, 2019

Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method.
IEEE Access, 2019

2018
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.
Sensors, 2018

A stochastic process based reliability prediction method for LED driver.
Reliab. Eng. Syst. Saf., 2018

A new hermetic sealing method for ceramic package using nanosilver sintering technology.
Microelectron. Reliab., 2018

A review on discoloration and high accelerated testing of optical materials in LED based-products.
Microelectron. Reliab., 2018

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging.
Microelectron. Reliab., 2018

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.
Microelectron. Reliab., 2018

Thermal Management on IGBT Power Electronic Devices and Modules.
IEEE Access, 2018

2017
Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems.
IEEE Trans. Ind. Electron., 2017

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.
Reliab. Eng. Syst. Saf., 2017

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
Microelectron. Reliab., 2017

Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method.
Microelectron. Reliab., 2017

Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products.
Microelectron. Reliab., 2017

Color shift acceleration on mid-power LED packages.
Microelectron. Reliab., 2017

Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages.
Microelectron. Reliab., 2017

Modeling nonlinear moisture diffusion in inhomogeneous media.
Microelectron. Reliab., 2017

Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.
IEEE Access, 2017

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method.
IEEE Access, 2017

2016
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.
IEEE Trans. Ind. Electron., 2016

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.
Reliab. Eng. Syst. Saf., 2016

Effects of stress-loading test methods on the degradation of light-emitting diode modules.
Microelectron. Reliab., 2016

Applications of advanced controlmethods in spacecrafts: progress, challenges, and future prospects.
Frontiers Inf. Technol. Electron. Eng., 2016

2015
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.
Microelectron. Reliab., 2015

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests.
Microelectron. Reliab., 2015

Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method.
Microelectron. Reliab., 2015

2014
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system.
Microelectron. Reliab., 2014

A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes.
Microelectron. Reliab., 2014

Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes.
Microelectron. Reliab., 2014

Multi-physics reliability simulation for solid state lighting drivers.
Microelectron. Reliab., 2014

Accelerated life time testing and optical degradation of remote phosphor plates.
Microelectron. Reliab., 2014

Reliability and optical properties of LED lens plates under high temperature stress.
Microelectron. Reliab., 2014

Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab., 2014

Thermal and mechanical effects of voids within flip chip soldering in LED packages.
Microelectron. Reliab., 2014

Blue selective photodiodes for optical feedback in LED wafer level packages.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2013
A novel soldering method to evaluate PCB pad cratering for pin-pull testing.
Microelectron. Reliab., 2013

Carbon Nanotube based heat-sink for solid state lighting.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

2012
Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach.
IEEE Trans. Signal Process., 2012

An approach to "Design for Reliability" in solid state lighting systems at high temperatures.
Microelectron. Reliab., 2012

Effects of single vacancy defect position on the stability of carbon nanotubes.
Microelectron. Reliab., 2012

A Distributed Semantic Web Approach for Cohort Identification.
Proceedings of the AMIA 2012, 2012

2010
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.
Sensors, 2010

A fast moisture sensitivity level qualification method.
Microelectron. Reliab., 2010

2009
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.
Microelectron. Reliab., 2009

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics.
Microelectron. Reliab., 2009

Numerical prediction of failure paths at a roughened metal/polymer interface.
Microelectron. Reliab., 2009

Comparing drop impact test method using strain gauge measurements.
Microelectron. Reliab., 2009

2008
Packaging influences on the reliability of MEMS resonators.
Microelectron. Reliab., 2008

The need for multi-scale approaches in Cu/low-k reliability issues.
Microelectron. Reliab., 2008

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
Microelectron. Reliab., 2008

Failure analysis of a thin-film nitride MEMS package.
Microelectron. Reliab., 2008

On chip-package stress interaction.
Microelectron. Reliab., 2008

2007
Molecular simulation on the material/interfacial strength of the low-dielectric materials.
Microelectron. Reliab., 2007

Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectron. Reliab., 2007

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.
Microelectron. Reliab., 2007

Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectron. Reliab., 2007

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
Microelectron. Reliab., 2007

Analysis of Cu/low-k bond pad delamination by using a novel failure index.
Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.
Microelectron. Reliab., 2007

Mechanical reliability challenges for MEMS packages: Capping.
Microelectron. Reliab., 2007

Advanced structural similarity rules for the BGA package family.
Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab., 2007

2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectron. Reliab., 2006

Multiscale modelling of multilayer substrates.
Microelectron. Reliab., 2006

Reliability challenges in the nanoelectronics era.
Microelectron. Reliab., 2006

Reliability modelling for packages in flexible end-products.
Microelectron. Reliab., 2006

Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem.
Eur. J. Oper. Res., 2006

2005
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectron. Reliab., 2005

2004
Integrated thermo-mechanical design and qualification of wafer backend structures.
Microelectron. Reliab., 2004

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.
Microelectron. Reliab., 2004

Prediction of crack growth in IC passivation layers.
Microelectron. Reliab., 2004

Prediction of thermo-mechanical integrity of wafer backend processes.
Microelectron. Reliab., 2004

Characterization and Modelling of Moisture Driven Interface Failures.
Microelectron. Reliab., 2004

Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.
Microelectron. Reliab., 2004

Characterization and fatigue damage simulation in SAC solder joints.
Microelectron. Reliab., 2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.
Microelectron. Reliab., 2004

2003
The challenges of virtual prototyping and qualification for future microelectronics.
Microelectron. Reliab., 2003

Prediction and verification of process induced warpage of electronic packages.
Microelectron. Reliab., 2003


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