Levent E. Aygun

According to our database, Levent E. Aygun authored at least 7 papers between 2016 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Large-Area Resistive Strain Sensing Sheet for Structural Health Monitoring.

Levent E. Aygun, Vivek Kumar, Campbell Weaver, Matthew Gerber, Sigurd Wagner, Naveen Verma, Branko Glisic, James C. Sturm

Sensors, 2020

2019

Hybrid LAE-CMOS Force-Sensing System Employing TFT-Based Compressed Sensing for Scalability of Tactile Sensing Skins.

Levent E. Aygun, Prakhar Kumar, Zhiwu Zheng, Ting-Sheng Chen, Sigurd Wagner, James C. Sturm, Naveen Verma

IEEE Trans. Biomed. Circuits Syst., 2019

Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing.

Levent E. Aygun, Prakhar Kumar, Zhiwu Zheng, Ting-Sheng Chen, Sigurd Wagner, James C. Sturm, Naveen Verma

Proceedings of the IEEE International Solid- State Circuits Conference, 2019

Analyzing and Increasing Yield of ZnO Thin-Film Transistors for Large-area Sensing Systems by Preventing Process-Induced Gate Dielectric Breakdown.

Zhiwu Zheng, Levent E. Aygun, Yoni Mehlman, Sigurd Wagner, Naveen Verma, James C. Sturm

Proceedings of the Device Research Conference, 2019

2018

Strain Transfer for Optimal Performance of Sensing Sheet.

Matthew Gerber, Campbell Weaver, Levent E. Aygun, Naveen Verma, James C. Sturm, Branko Glisic

Sensors, 2018

Artificial intelligence meets large-scale sensing: Using Large-Area Electronics (LAE) to enable intelligent spaces.

Murat Ozatay, Levent E. Aygun, Hongyang Jia, Prakhar Kumar, Yoni Mehlman, Can Wu, Sigurd Wagner, James C. Sturm, Naveen Verma

Proceedings of the 2018 IEEE Custom Integrated Circuits Conference, 2018

2016

Hybrid large-area systems and their interconnection backbone (invited paper).

Naveen Verma, Levent E. Aygun, Yasmin Afsar, Yingzhe Hu, Liechao Huang, Tiffany Moy, Josue Sanz-Robinson, Warren Rieutort-Louis, Sigurd Wagner, James C. Sturm

Proceedings of the Tenth IEEE/ACM International Symposium on Networks-on-Chip, 2016