Linwei Cao

Orcid: 0009-0008-5957-5403

According to our database¹, Linwei Cao authored at least 2 papers in 2025.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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Bibliography

2025

Application of Embedded Stress Sensors for Third-Generation Reliability of Electronic Systems: Validation and Calibration of Mechanical Models in Fan-Out Wafer-Level Packaging.

[BibT_eX]

[DOI]

IEEE Trans. Reliab., December, 2025

Integrated Temperature and Stress Sensors in Fan-Out Wafer-Level Packaging to Better Achieve the Third-Generation Reliability of Electronic Systems.

[BibT_eX]

[DOI]

IEEE Trans. Reliab., September, 2025

Linwei Cao

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