Quanfeng Zhou
According to our database1,
Quanfeng Zhou authored at least 2 papers
in 2025.
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Bibliography
2025
Application of Embedded Stress Sensors for Third-Generation Reliability of Electronic Systems: Validation and Calibration of Mechanical Models in Fan-Out Wafer-Level Packaging.
IEEE Trans. Reliab., December, 2025
Integrated Temperature and Stress Sensors in Fan-Out Wafer-Level Packaging to Better Achieve the Third-Generation Reliability of Electronic Systems.
IEEE Trans. Reliab., September, 2025