Yao Yao
Orcid: 0000-0002-0879-4269Affiliations:
- Northwestern Polytechnical University, Xi'an, China
- Northwestern University, Evanston, IL, USA (PhD 2008)
According to our database1,
Yao Yao authored at least 8 papers
between 2008 and 2026.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2026
Design and Validation of Corner Nonfunctional Solder Joint Canaries Using Damage Modeling and Four-Point Bending Tests.
IEEE Trans. Reliab., 2026
2025
Application of Embedded Stress Sensors for Third-Generation Reliability of Electronic Systems: Validation and Calibration of Mechanical Models in Fan-Out Wafer-Level Packaging.
IEEE Trans. Reliab., December, 2025
2019
An Entropy-Based Failure Prediction Model for the Creep and Fatigue of Metallic Materials.
Entropy, 2019
2017
Entropy, 2017
2013
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.
Microelectron. Reliab., 2013
Proceedings of the 3rd IFAC International Conference on Intelligent Control and Automation Science, 2013
2009
Proceedings of the IEEE International Conference on Robotics and Biomimetics, 2009
2008
Proceedings of the International Conference on Computer Science and Software Engineering, 2008