Lovelace Soirez

According to our database, Lovelace Soirez authored at least 2 papers between 2016 and 2025.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2025

Copper Damascene Based Heterogeneous Integration of GaN with CMOS on 200 mm Si Substrates (Invited).

Jeffrey LaRoche, Lovelace Soirez, Eduardo Chumbes

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2016

Front-side mid-level Tungsten TSV integration for high-density 3D applications.

Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016