Martin Kraft

Orcid: 0000-0003-1175-0037

According to our database1, Martin Kraft authored at least 11 papers between 2016 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

On csauthors.net:

Bibliography

2026
Outline of a technical solution for remote barn climate monitoring.
Proceedings of the 46. GIL-Jahrestagung, Informatik in der Land-, Forst- und Ernährungswirtschaft, 2026

2024
The FAIR-Device - an AI image recognition-based non-lethal and generalist monitoring system for insect biodiversity in agriculture.
Proceedings of the 44. GIL-Jahrestagung, Informatik in der Land-, Forst- und Ernährungswirtschaft, 2024

2022
Digitalisierung und Innovation in der Landwirtschaft.
Proceedings of the 52. Jahrestagung der Gesellschaft für Informatik, INFORMATIK 2022, Informatik in den Naturwissenschaften, 26., 2022

Organizational aspects of digitalization in the context of agriculture: Exemplary results from analyzing data flows in German dairy farming.
Proceedings of the CENTERIS 2022 - International Conference on ENTERprise Information Systems / ProjMAN - International Conference on Project MANagement / HCist, 2022

2020
A Comparison of Different Counting Methods for a Holographic Particle Counter: Designs, Validations and Results.
Sensors, 2020

Virtual Sensing of Temperatures in Indoor Environments: A Case Study.
Proceedings of the 20th International Conference on Data Mining Workshops, 2020

2019
Characterization of a Robust 3D- and Inkjet-Printed Capacitive Position Sensor for a Spectrometer Application.
Sensors, 2019

Design and Validation of a Holographic Particle Counter.
Sensors, 2019

2017
How to teach your robot in 5 minutes: Applying UX paradigms to human-robot-interaction.
Proceedings of the 26th IEEE International Symposium on Robot and Human Interactive Communication, 2017

2016
Direct optical stress sensing in semiconductor manufacturing using Raman micro-spectrometry.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016


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