Martin Lederer

Orcid: 0000-0002-3775-7803

According to our database1, Martin Lederer authored at least 6 papers between 2012 and 2023.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2023
FCAS Ethical AI Demonstrator.
Proceedings of the Joint Proceedings of the xAI-2023 Late-breaking Work, 2023

2018
Effect of aging on mechanical properties of high temperature Pb-rich solder joints.
Microelectron. Reliab., 2018

2017
Reliability of Cu wire bonds in microelectronic packages.
Microelectron. Reliab., 2017

High cycle fatigue testing of thermosonic ball bonds.
Microelectron. Reliab., 2017

2016
Delamination of polyimide/Cu films under mixed mode loading.
Microelectron. Reliab., 2016

2012
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions.
Microelectron. Reliab., 2012


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