Martin Schneider-Ramelow

According to our database1, Martin Schneider-Ramelow authored at least 9 papers between 2011 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2023
The European Union's Energy Label for Smartphones: Does it Guide Consumers to Make Environmentally Sustainable Choices?
Proceedings of the 13th IEEE International Conference on Consumer Electronics - Berlin, 2023

2021
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2019
Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method.
Proceedings of the 12th International Conference on Developments in eSystems Engineering, 2019

2018
Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics.
Microelectron. Reliab., 2018

2017
The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.
Proceedings of the Eleventh International Conference on Sensing Technology, 2017

2016
The reliability of wire bonding using Ag and Al.
Microelectron. Reliab., 2016

2015
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding.
Microelectron. Reliab., 2015

2014
The influence of liners with Ti, Ta or Ru finish on thin Cu films.
Microelectron. Reliab., 2014

2011
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C.
Microelectron. Reliab., 2011


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