Oswin Ehrmann

According to our database, Oswin Ehrmann authored at least 4 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2018

Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster.

Kai Zoschke, Maurice Güttler, Lars Böttcher, Andreas Grübl, Dan Husmann de Oliveira, Johannes Schemmel, Karlheinz Meier, Oswin Ehrmann

CoRR, 2018

2017

The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.

Ha-Duong Ngo, Piotr Mackowiak, Niels Grabbert, Thomas Weiland, Xiaodong Hu, Martin Schneider-Ramelow, Oswin Ehrmann, Klaus-Dieter Lang

Proceedings of the Eleventh International Conference on Sensing Technology, 2017

2016

A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems.

Ha-Duong Ngo, Biswajit Mukhopadhyay, Piotr Mackowiak, Kevin Kröhnert, Oswin Ehrmann, Klaus-Dieter Lang

Micromachines, 2016

2015

Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments.

Ha-Duong Ngo, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang

Sensors, 2015