Meng-Kai Shih

According to our database, Meng-Kai Shih authored at least 2 papers between 2010 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.

Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang

Microelectron. Reliab., 2012

2010

Geometric design for ultra-long needle probe card for digital light processing wafer testing.

Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai

Microelectron. Reliab., 2010