Chang-Chi Lee
Orcid: 0000-0003-0638-5426
According to our database1,
Chang-Chi Lee
authored at least 7 papers
between 2011 and 2020.
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Bibliography
2020
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package.
IEEE Access, 2020
IEEE Access, 2020
2019
Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology.
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2019
2017
A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation.
IEEE Trans. Circuits Syst. I Regul. Pap., 2017
2013
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.
Microelectron. Reliab., 2013
2012
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
Microelectron. Reliab., 2012
2011
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA.
Microelectron. Reliab., 2011