Mengru Huang
Orcid: 0009-0003-5026-6923
According to our database1,
Mengru Huang
authored at least 3 papers
between 2024 and 2026.
Collaborative distances:
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Bibliography
2026
Expert Syst. Appl., 2026
2025
IEEE Trans. Consumer Electron., August, 2025
2024
Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.
IEICE Electron. Express, 2024