Michal Szermer
Orcid: 0000-0002-9294-701X
  According to our database1,
  Michal Szermer
  authored at least 20 papers
  between 2004 and 2024.
  
  
Collaborative distances:
Collaborative distances:
Timeline
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Online presence:
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    on orcid.org
On csauthors.net:
Bibliography
  2024
    Proceedings of the 31st International Conference on Mixed Design of Integrated Circuits and System , 2024
    
  
  2023
    Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023
    
  
  2022
Observation of Readout Temperature Dependence and Its Variability for the MEMS and ASIC System Specimens and Their PCB Testbenches.
    
  
    Proceedings of the 29th International Conference on Mixed Design of Integrated Circuits and System, 2022
    
  
  2021
A Capacitive 3-Axis MEMS Accelerometer for Medipost: A Portable System Dedicated to Monitoring Imbalance Disorders.
    
  
    Sensors, 2021
    
  
  2020
    Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020
    
  
  2019
Application of Offset Trimming Circuit for Reducing the Impact of Parasitics in Capacitive Sensor Readout Circuit.
    
  
    Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019
    
  
  2018
    Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018
    
  
  2015
    Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015
    
  
    Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015
    
  
    Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015
    
  
  2014
Evaluating the impact of scaling on temperature in FinFET-technology multicore processors.
    
  
    Microelectron. J., 2014
    
  
    Microelectron. J., 2014
    
  
    Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014
    
  
The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties.
    
  
    Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014
    
  
    Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014
    
  
    Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014
    
  
  2013
New methodology for thermal analysis of multi-core processors based on dedicated ASIC.
    
  
    Microelectron. J., 2013
    
  
Application of a genetic algorithm for dimension optimization of the MEMS-based accelerometer.
    
  
    Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013
    
  
    Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013
    
  
  2004
    Microelectron. J., 2004