Michal Szermer

Orcid: 0000-0002-9294-701X

According to our database1, Michal Szermer authored at least 19 papers between 2004 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Online presence:

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Bibliography

2023
Preliminary Characterization of An Electro-Thermal Converter.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

2022
Observation of Readout Temperature Dependence and Its Variability for the MEMS and ASIC System Specimens and Their PCB Testbenches.
Proceedings of the 29th International Conference on Mixed Design of Integrated Circuits and System, 2022

2021
A Capacitive 3-Axis MEMS Accelerometer for Medipost: A Portable System Dedicated to Monitoring Imbalance Disorders.
Sensors, 2021

2020
CMOS Interface for Capacitive Sensors with Custom Fully-Differential Amplifiers.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

2019
Application of Offset Trimming Circuit for Reducing the Impact of Parasitics in Capacitive Sensor Readout Circuit.
Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

2018
MEMS Gyroscope FEM Modeling and Simulation.
Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018

2015
Mixed signal ASIC controller for satellite medium power DC/DC converters.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

A study on microbolometer electro-thermal circuit modelling.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

Custom method for automation of microbolometer design and simulation.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

2014
Evaluating the impact of scaling on temperature in FinFET-technology multicore processors.
Microelectron. J., 2014

Dedicated thermal emulator for analysis of thermal coupling in many-core processors.
Microelectron. J., 2014

Multiscale flow model for simulation of biofluidic mixtures in Lab-Chip devices.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

Monte Carlo modeling of stiffness of MEMS membrane.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

Modelling modern processors using FEM and compact model - A comparative study.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

2013
New methodology for thermal analysis of multi-core processors based on dedicated ASIC.
Microelectron. J., 2013

Application of a genetic algorithm for dimension optimization of the MEMS-based accelerometer.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013

Influence of Scaling on IC Temperature in FinFET Microprocessor Technologies.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013

2004
Ion sensitive field effect transistor modelling for multidomain simulation purposes.
Microelectron. J., 2004


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