Melvin Galicia

According to our database, Melvin Galicia authored at least 11 papers between 2013 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Frequency and noise characterization for baseband signal processing on neuromorphic circuits.

Melvin Galicia, Leon Happek, Magnus Balzer, Rainer Leupers

Proceedings of the 21st IEEE Interregional NEWCAS Conference, 2023

"S3cure": Scramble, Shuffle and Shambles - Secure Deployment of Weight Matrices in Memristor Crossbar Arrays.

Melvin Estuardo Galicia, Ibrahim Jimale Osman, Christian Owusu-Afriyie, Rainer Leupers

Proceedings of the 2023 International Conference on Neuromorphic Systems, 2023

2022

A Parallel SystemC Virtual Platform for Neuromorphic Architectures.

Melvin Galicia, Farhad Merchant, Rainer Leupers

Proceedings of the 23rd International Symposium on Quality Electronic Design, 2022

NEUROTEC I: Neuro-inspired Artificial Intelligence Technologies for the Electronics of the Future.

Melvin Galicia, Stephan Menzel, Farhad Merchant, Maximilian Müller, Hsin-Yu Chen, Qing-Tai Zhao, Felix Cüppers, Abdur R. Jalil, Qi Shu, Peter Schüffelgen, Gregor Mussler, Carsten Funck, Christian Lanius, Stefan Wiefels, Moritz von Witzleben, Christopher Bengel, Nils Kopperberg, Tobias Ziegler, R. Walied Ahmad, Alexander Krüger, Leticia Pöhls, Regina Dittmann, Susanne Hoffmann-Eifert, Vikas Rana, Detlev Grützmacher, Matthias Wuttig, Dirk J. Wouters, Andrei Vescan, Tobias Gemmeke, Joachim Knoch, Max C. Lemme, Rainer Leupers, Rainer Waser

Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021

NeuroVP: A System-Level Virtual Platform for Integration of Neuromorphic Accelerators.

Melvin Galicia, Ali BanaGozar, Karl J. X. Sturm, Felix Staudigl, Sander Stuijk, Henk Corporaal, Rainer Leupers

Proceedings of the 34th IEEE International System-on-Chip Conference, 2021

2018

Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels.

Piotr Zajac, Melvin Galicia, Andrzej Napieralski

Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018

2016

Impact of floorplanning and thermal vias placement on temperature in 2D and 3D processors.

Piotr Zajac, Melvin Galicia, Cezary Maj, Andrzej Napieralski

Microelectron. J., 2016

Coupled thermo-fluidic simulation for design space exploration of microchannels in liquid-cooled 3D ICs.

Piotr Zajac, Cezary Maj, Melvin Galicia, Andrzej Napieralski

Proceedings of the 2016 MIXDES, 2016

2015

Investigation of localized thermal vias for temperature reduction in 3D multicore processors.

Piotr Zajac, Melvin Galicia, Cezary Maj, Andrzej Napieralski

Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

2014

Modelling modern processors using FEM and compact model - A comparative study.

Melvin Galicia, Piotr Zajac, Cezary Maj, Michal Szermer, Andrzej Napieralski

Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

2013

Systematic integration guidance for alleviating substation congestions of steel mill power systems by distributed generation units.

Cheng-Tsung Liu, Kuo-Yuan Hung, Melvin E. Galicia, Sheng-Yang Lin

Proceedings of the 2013 IEEE Industry Applications Society Annual Meeting, 2013