Ming-Chih Yew

According to our database, Ming-Chih Yew authored at least 3 papers between 2006 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2008

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact.

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang

Microelectron. Reliab., 2008

2007

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis.

Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang

Microelectron. Reliab., 2007

2006

The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis.

Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang

Microelectron. Reliab., 2006