Wen-Kun Yang

According to our database1, Wen-Kun Yang authored at least 1 paper in 2008.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2008
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact.
Microelectron. Reliab., 2008


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