Nikhilesh Chawla

According to our database, Nikhilesh Chawla authored at least 8 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Computational Imaging in 3D X-Ray Microscopy: Reconstruction, Image Segmentation and Time-Evolved Experiments.

Sridhar Niverty, Hamid Torbatissaraf, Viktor V. Nikitin, Vincent De Andrade, Stanislau Niauzorau, Natalia Kublik, Bruno Azeredo, Aniket Tekawade, Francesco De Carlo, Nikhilesh Chawla

Proceedings of the 2021 IEEE International Conference on Image Processing, 2021

2017

In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM).

Renuka Vallabhaneni, Ehsan Izadi, Carl R. Mayer, C. Shashank Kaira, Sudhanshu S. Singh, Jagannathan Rajagopalan, Nikhilesh Chawla

Microelectron. Reliab., 2017

2015

In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens.

James C. E. Mertens, Antony Kirubanandham, Nikhilesh Chawla

Microelectron. Reliab., 2015

Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth.

Kyle Doudrick, Jeff Chinn, Jason Williams, Nikhilesh Chawla, Konrad Rykaczewski

Microelectron. Reliab., 2015

2013

Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints.

H. X. Xie, Nikhilesh Chawla

Microelectron. Reliab., 2013

2012

Data intensive science at synchrotron based 3D x-ray imaging facilities.

Francesco De Carlo, Xianghui Xiao, Kamel Fezzaa, Steve Wang, Nicholas Schwarz, Chris Jacobsen, Nikhilesh Chawla, Florian Fusseis

Proceedings of the 8th IEEE International Conference on E-Science, 2012

2011

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys.

H. X. Xie, Nikhilesh Chawla, Yu-Lin Shen

Microelectron. Reliab., 2011

2009

Interfacial fracture toughness of Pb-free solders.

S. M. Hayes, Nikhilesh Chawla, D. R. Frear

Microelectron. Reliab., 2009