Yu-Lin Shen

According to our database, Yu-Lin Shen authored at least 9 papers between 2002 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

An E-Commerce Coupon Target Population Positioning Model Based on Random Forest and eXtreme Gradient Boosting.

Zhang-Fa Yan, Yu-Lin Shen, Wei-Jun Liu, Jie-Min Long, Qingyang Wei

Proceedings of the 11th International Congress on Image and Signal Processing, 2018

Detection of Epilepsy Using MFCC-Based Feature and XGBoost.

Jie-Min Long, Zhang-Fa Yan, Yu-Lin Shen, Wei-Jun Liu, Qing-Yang Wei

Proceedings of the 11th International Congress on Image and Signal Processing, 2018

2016

Numerical study of microbump failure in 3D microelectronic structures.

Yu-Lin Shen, Geno C. Flores, J. Guthrie

Microelectron. Reliab., 2016

2013

Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment.

Yu-Lin Shen, R. W. Johnson

Microelectron. Reliab., 2013

2012

Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging.

E. J. Cheng, Yu-Lin Shen

Microelectron. Reliab., 2012

2011

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys.

H. X. Xie, Nikhilesh Chawla, Yu-Lin Shen

Microelectron. Reliab., 2011

2010

Numerical study of ductile failure morphology in solder joints under fast loading conditions.

Yu-Lin Shen, K. Aluru

Microelectron. Reliab., 2010

2007

On the failure path in shear-tested solder joints.

W. H. Moy, Yu-Lin Shen

Microelectron. Reliab., 2007

2002

Analysis of thermal stresses in metal interconnects with multilevel structures.

M. S. Kilijanski, Yu-Lin Shen

Microelectron. Reliab., 2002