Nobuyuki Shishido

According to our database1, Nobuyuki Shishido authored at least 3 papers between 2013 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2015
Scenario for catastrophic failure in interconnect structures under chip package interaction.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2013
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.
Microelectron. Reliab., 2013

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method.
Microelectron. Reliab., 2013


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