Tomoji Nakamura

According to our database, Tomoji Nakamura authored at least 7 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy.

Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2015

Scenario for catastrophic failure in interconnect structures under chip package interaction.

Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Characterization of stress distribution in ultra-thinned DRAM wafer.

Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure.

Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.

Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Microelectron. Reliab., 2013

2011

Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.

Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects.

Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011