Pearl A. Agyakwa

According to our database, Pearl A. Agyakwa authored at least 6 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement.

Mohd. Amir Eleffendi, Li Yang, Pearl A. Agyakwa, C. Mark Johnson

Microelectron. Reliab., 2016

A thermal cycling reliability study of ultrasonically bonded copper wires.

Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson

Microelectron. Reliab., 2016

2014

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods.

Elaheh Arjmand, Pearl A. Agyakwa, C. Mark Johnson

Microelectron. Reliab., 2014

2013

Degradation of thermal interface materials for high-temperature power electronics applications.

R. Skuriat, J. F. Li, Pearl A. Agyakwa, N. Mattey, Paul Evans, C. Mark Johnson

Microelectron. Reliab., 2013

2011

A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects.

Li Yang, Pearl A. Agyakwa, C. Mark Johnson

Microelectron. Reliab., 2011

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling.

Pearl A. Agyakwa, Martin R. Corfield, Li Yang, J. F. Li, V. M. F. Marques, C. Mark Johnson

Microelectron. Reliab., 2011