C. Mark Johnson

Orcid: 0000-0002-7546-0453

Affiliations:
  • University of Nottingham, UK


According to our database1, C. Mark Johnson authored at least 23 papers between 2007 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2018
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints.
Microelectron. Reliab., 2018

2017
A study on probability of distribution loads based on expectation maximization algorithm.
Proceedings of the IEEE Power & Energy Society Innovative Smart Grid Technologies Conference, 2017

2016
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement.
Microelectron. Reliab., 2016

A thermal cycling reliability study of ultrasonically bonded copper wires.
Microelectron. Reliab., 2016

An integrated on-board battery charger with a nine-phase PM machine.
Proceedings of the IECON 2016, 2016

2015
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies.
Microelectron. Reliab., 2015

Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid.
Proceedings of the 2015 IEEE Power & Energy Society Innovative Smart Grid Technologies Conference, 2015

A novel stochastic modelling approach for electric vehicle charging power and energy requirements.
Proceedings of the 2015 IEEE Power & Energy Society Innovative Smart Grid Technologies Conference, 2015

FEA based thermal analysis of various topologies for Integrated Motor Drives (IMD).
Proceedings of the IECON 2015, 2015

2014
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules.
Microelectron. Reliab., 2014

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods.
Microelectron. Reliab., 2014

2013
Degradation of thermal interface materials for high-temperature power electronics applications.
Microelectron. Reliab., 2013

Microgrid unbalance compensator - Mitigating the negative effects of unbalanced microgrid operation.
Proceedings of the 4th IEEE PES Innovative Smart Grid Technologies Europe, 2013

Energy management research using emulators of renewable generation and loads.
Proceedings of the IEEE PES Innovative Smart Grid Technologies Conference, 2013

2012
An Efficient Implementation of the Rainflow Counting Algorithm for Life Consumption Estimation.
IEEE Trans. Reliab., 2012

Repetitive high peak current pulsed discharge film-capacitor reliability testing.
Microelectron. Reliab., 2012

A closed-loop IGBT non-destructive tester.
Microelectron. Reliab., 2012

Coordinated optimal dispatch of distributed energy resources within a smart energy community cell.
Proceedings of the 3rd IEEE PES Innovative Smart Grid Technologies Europe, 2012

2011
A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects.
Microelectron. Reliab., 2011

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling.
Microelectron. Reliab., 2011

Investigating the effects of dynamic demand side management within intelligent Smart Energy communities of future decentralized power system.
Proceedings of the 2nd IEEE PES International Conference and Exhibition on "Innovative Smart Grid Technologies", 2011

2010
Designing a Low-Cost, Electricity-Generating Cooking Stove.
IEEE Technol. Soc. Mag., 2010

2007
Estimation and control of power electronic device temperature during operation with variable conducting current.
IET Circuits Devices Syst., 2007


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