Poi-Siong Teo

According to our database1, Poi-Siong Teo
  • authored at least 1 paper in 2004.
  • has a "Dijkstra number"2 of five.

Timeline

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Links

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Bibliography

2004
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectronics Reliability, 2004


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