Xiaowu Zhang

According to our database, Xiaowu Zhang authored at least 34 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Scarcity-GAN: Scarce data augmentation for defect detection via generative adversarial nets.

Chaobin Xu, Wei Li, Xiaohui Cui, Zhenyu Wang, Fengling Zheng, Xiaowu Zhang, Bin Chen

Neurocomputing, January, 2024

2023

Hyperspectral Image Super-Resolution Algorithm Based on Graph Regular Tensor Ring Decomposition.

Shasha Sun, Wenxing Bao, Kewen Qu, Wei Feng, Xiaowu Zhang, Xuan Ma

Remote. Sens., October, 2023

Does Correction Remain A Problem For Large Language Models?

Xiaowu Zhang, Xiaotian Zhang, Cheng Yang, Hang Yan, Xipeng Qiu

CoRR, 2023

XRoute Environment: A Novel Reinforcement Learning Environment for Routing.

Zhanwen Zhou, Hankz Hankui Zhuo, Xiaowu Zhang, Qiyuan Deng

CoRR, 2023

Urban Water Supply Forecasting Based on CNN-LSTM-AM Spatiotemporal Deep Learning Model.

Yaxin Zhao, Yuebing Xu, Jiadong Ye, Xiaowu Zhang, Zuqiang Long

IEEE Access, 2023

Multispectral and Hyperspectral Image Fusion Based on Coupled Non-Negative Block Term Tensor Decomposition with Joint Structured Sparsity.

Hao Guo, Wenxing Bao, Wei Feng, Shasha Sun, Lei Yang, Kewen Qu, Xuan Ma, Xiaowu Zhang

Proceedings of the IEEE International Geoscience and Remote Sensing Symposium, 2023

CryptoMask: Privacy-Preserving Face Recognition.

Jianli Bai, Xiaowu Zhang, Xiangfu Song, Hang Shao, Qifan Wang, Shujie Cui, Giovanni Russello

Proceedings of the Information and Communications Security - 25th International Conference, 2023

Mostree: Malicious Secure Private Decision Tree Evaluation with Sublinear Communication.

Jianli Bai, Xiangfu Song, Xiaowu Zhang, Qifan Wang, Shujie Cui, Ee-Chien Chang, Giovanni Russello

Proceedings of the Annual Computer Security Applications Conference, 2023

2022

Grouped Collaborative Representation for Hyperspectral Image Classification Using a Two-Phase Strategy.

Xiangfei Shen, Wenxing Bao, Hongbo Liang, Xiaowu Zhang, Xuan Ma

IEEE Geosci. Remote. Sens. Lett., 2022

HSI-Mixer: Hyperspectral Image Classification Using the Spectral-Spatial Mixer Representation From Convolutions.

Hongbo Liang, Wenxing Bao, Xiangfei Shen, Xiaowu Zhang

IEEE Geosci. Remote. Sens. Lett., 2022

Nonlocal Low-Rank Regularization for Hyperspectral and High-Resolution Remote Sensing Image Fusion.

Meng Cao, Wenxing Bao, Kewen Qu, Xiaowu Zhang, Xuan Ma

Proceedings of the IEEE International Geoscience and Remote Sensing Symposium, 2022

2021

Spectral-Spatial Attention Feature Extraction for Hyperspectral Image Classification Based on Generative Adversarial Network.

Hongbo Liang, Wenxing Bao, Xiangfei Shen, Xiaowu Zhang

IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2021

A Joint Spatial-Spectral Representation Based Capsule Network for Hyperspectral Image Classification.

Qun Zhou, Wenxing Bao, Xiaowu Zhang, Xuan Ma

Proceedings of the 11th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing, 2021

Attentional Neural Factorization Machines for Knowledge Tracing.

Xiaowu Zhang, Li Li

Proceedings of the Knowledge Science, Engineering and Management, 2021

2020

Mode Shift Schedule and Control Strategy Design of Multimode Hybrid Powertrain.

Weichao Zhuang, Xiaowu Zhang, Guodong Yin, Huei Peng, Liangmo Wang

IEEE Trans. Control. Syst. Technol., 2020

Fine-Tuned Transformer Model for Sentiment Analysis.

Sishun Liu, Pengju Shuai, Xiaowu Zhang, Shuang Chen, Li Li, Ming Liu

Proceedings of the Knowledge Science, Engineering and Management, 2020

2018

Minimize the Fuel Consumption of Connected Vehicles Between Two Red-Signalized Intersections in Urban Traffic.

Qingfeng Lin, Shengbo Eben Li, Xuejin Du, Xiaowu Zhang, Huei Peng, Yugong Luo, Keqiang Li

IEEE Trans. Veh. Technol., 2018

2017

Optimal design of three-planetary-gear power-split hybrid powertrains.

Weichao Zhuang, Xiaowu Zhang, Ding Zhao, Huei Peng, Lianmou Wang

CoRR, 2017

2016

Design of Multimode Power-Split Hybrid Vehicles - A Case Study on the Voltec Powertrain System.

Xiaowu Zhang, Shengbo Eben Li, Huei Peng, Jing Sun

IEEE Trans. Veh. Technol., 2016

Fuel-Saving Cruising Strategies for Parallel HEVs.

Shaobing Xu, Shengbo Eben Li, Huei Peng, Bo Cheng, Xiaowu Zhang, Ziheng Pan

IEEE Trans. Veh. Technol., 2016

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis.

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin

Microelectron. Reliab., 2016

2015

Fuel-Optimal Cruising Strategy for Road Vehicles With Step-Gear Mechanical Transmission.

Shaobing Xu, Shengbo Eben Li, Xiaowu Zhang, Bo Cheng, Huei Peng

IEEE Trans. Intell. Transp. Syst., 2015

A Near-Optimal Power Management Strategy for Rapid Component Sizing of Multimode Power Split Hybrid Vehicles.

Xiaowu Zhang, Huei Peng, Jing Sun

IEEE Trans. Control. Syst. Technol., 2015

Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package.

Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang

IEEE Des. Test, 2015

2013

A near-optimal power management strategy for rapid component sizing of power split hybrid vehicles with multiple operating modes.

Xiaowu Zhang, Huei Peng, Jing Sun

Proceedings of the American Control Conference, 2013

2012

Prius⁺ and Volt^-: Configuration Analysis of Power-Split Hybrid Vehicles With a Single Planetary Gear.

Xiaowu Zhang, Chiao-Ting Li, Dongsuk Kum, Huei Peng

IEEE Trans. Veh. Technol., 2012

Modular sensor chip design for package stress evaluation and reliability characterisation.

A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai

Microelectron. Reliab., 2012

2011

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Electromigration performance of Through Silicon Via (TSV) - A modeling approach.

Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu

Microelectron. Reliab., 2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2009

Mapping the failure envelope of board-level solder joints.

Long Bin Tan, Xiaowu Zhang, Chwee Teck Lim, Vincent B. C. Tan

Microelectron. Reliab., 2009

2008

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).

Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala

Microelectron. Reliab., 2008

2005

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.

Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

Microelectron. Reliab., 2005

2004

Thermo-mechanical finite element analysis in a multichip build up substrate based package design.

Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath

Microelectron. Reliab., 2004