D. Pinjala

According to our database1, D. Pinjala authored at least 2 papers between 2004 and 2008.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2008
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).
Microelectronics Reliability, 2008

2004
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectronics Reliability, 2004


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