Rainer Tilgner

According to our database, Rainer Tilgner authored at least 4 papers between 2003 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2008

Advanced thermal failure analysis and reliability investigations - Industrial demands and related limitations.

Andreas Altes, Rainer Tilgner, Markus Reissner, Grazyna Steckert, Gerald Neumann

Microelectron. Reliab., 2008

2006

Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity.

Andreas Altes, Rainer Tilgner, W. Walter

Microelectron. Reliab., 2006

2004

Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages.

Peter Alpern, Kheng Chooi Lee, Rainer Tilgner

Microelectron. Reliab., 2004

2003

Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures.

P. Rajamand, Rainer Tilgner, Roland Schmidt, J. Baumann, P. Klofac, M. Rothenfusser

Microelectron. Reliab., 2003