Kheng Chooi Lee

According to our database, Kheng Chooi Lee authored at least 3 papers between 2004 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.

Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan

Microelectron. Reliab., 2016

2005

A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages.

Kheng Chooi Lee, A. Vythilingam, Peter Alpern

Microelectron. Reliab., 2005

2004

Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages.

Peter Alpern, Kheng Chooi Lee, Rainer Tilgner

Microelectron. Reliab., 2004