Rohit Dhiman

Orcid: 0000-0001-9059-5885

According to our database1, Rohit Dhiman authored at least 13 papers between 2011 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs.
Microelectron. J., November, 2023

2022
A physics-based drain current model for Si<sub>1-x</sub>Ge<sub>x</sub> source/drain NT JLFET for enhanced hot carrier reliability with temperature measurement.
Microelectron. J., 2022

Proposal and analysis of carbon nanotube based differential multibit through glass vias.
Microelectron. J., 2022

Differential Multi-bit Through Glass Vias for Three-Dimensional Integrated Circuits.
Proceedings of the VLSI Design and Test - 26th International Symposium, 2022

2021
Proposal and analysis of relative stability in mixed CNT bundle for sub-threshold interconnects.
Integr., 2021

Brain-Computer Interfacing: Design of Virtual Keyboard.
Proceedings of the 12th International Conference on Computing Communication and Networking Technologies, 2021

2019
Design and Performance Analysis of SiGe Hetero Nanotube Junctionless FET.
Proceedings of the TENCON 2019, 2019

2017
Delay and Frequency Investigations in Coupled MLGNR Interconnects.
Proceedings of the VLSI Design and Test - 21st International Symposium, 2017

2016
A 60 dB Bulk-Driven Rail-to-Rail Input/Output OTA.
Proceedings of the IEEE International Symposium on Nanoelectronic and Information Systems, 2016

Performance Analysis of Top-Contact MLGNR Based Interconnects.
Proceedings of the IEEE International Symposium on Nanoelectronic and Information Systems, 2016

2015
Dynamic Crosstalk Analysis in Coupled Interconnects for Ultra-Low Power Applications.
Circuits Syst. Signal Process., 2015

2012
Sub-Threshold Delay and Power Analysis of Complementary Metal-Oxide Semiconductor Buffer Driven Interconnect Load for Ultra Low Power Applications.
J. Low Power Electron., 2012

2011
Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect.
Proceedings of the ICWET '11 International Conference & Workshop on Emerging Trends in Technology, Mumbai, Maharashtra, India, February 25, 2011


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