Ryan Lu

According to our database, Ryan Lu authored at least 13 papers between 2018 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives.

Ching-Ting Liu, Yao-Chun Chuang, Jyun-Lin Wu, Jia-Shen Lan, Chang-Fu Han, Chia-Hua Chang, Jia-Ming Yang, Yu-Sheng Lin, Chen-Wei Li, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Well-Charging Damage to Capacitors Connected Between VDD and VSS in a Single Power Domain.

Hsi-Yu Kuo, Yu-Lin Chu, Chien-Jen Wang, Steven Sze Hang Poon, Chun-Wei Yao, Hsuan Chu, Yi-Ching Chen, Yi-Lun Chen, Yu-Ti Su, Chia-Lin Hsu, Tsung-Yuan Chen, Te-Liang Li, Ray Huang, Kuo-Ji Chen, Ming-Hsiang Song, Kejun Xia, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Comprehensive Study of Non-Conducting Stress Characteristics in Ultra-Scaled FinFET.

Jun-Yu Huang, Clement Huang, Kun-Chung Huang, Da-You Yang, Hsin-Jou Chuang, Yi-Wen Lee, Eliot Chen, Jen-Hao Lee, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Characterization of Cu and SiCN Adhesion in BEOL Interconnections.

Chang-Fu Han, Jia-Ming Yang, Chia-Hua Chang, Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Exploring AC Time-Dependent Dielectric Breakdown (TDDB) Through Frequency Noise Analysis.

Y. K. Chang, P. J. Liao, Y. C. Chang, C. H. Chou, Y. S. Liu, J. H. Lee, Ryan Lu, Y. K. Hwang

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Refined High Resistance Baking Approaches for Optimal Interconnect Reliability.

H. C. Chang, Eliot Chen, P. J. Liao, J. H. Lee, Ryan Lu, Y. K. Hwang

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Electromigration Performance of Cu Bumps in Various Configurations.

Jui-Shen Chang, Chung-Yu Chiu, Ching-Ting Liu, Chen-Nan Chiu, Yao-Chun Chuang, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2024

Layout Guidelines against Charging Damage from the Well-Side Antennas in Separated Power Domains.

Hsi-Yu Kuo, Yu-Lin Chu, Hung-Da Dai, Chun-Chi Wang, Pei-Jung Lin, Shu-Cheng Kuo, Ethan Guo, Ya-Min Zhang, Yu-Ti Su, Chia-Lin Hsu, Kuan-Hung Chen, Tsung-Yuan Chen, Te-Liang Li, Ray Huang, Kuo-Ji Chen, Ming-Hsiang Song, Ryan Lu, Kejun Xia

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Reliability Challenges from 2.5D to 3DIC in Advanced Package Development.

Ryan Lu, Yao-Chun Chuang, Jyun-Lin Wu, Jun He

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Protection Schemes for Plasma Induced Damage from Well-Side Antennas.

Hsi-Yu Kuo, Yu-Lin Chu, Hung-Da Dai, Chun-Chi Wang, Pei-Jung Lin, Ethan Guo, Yu-Ti Su, Chia-Lin Hsu, Kuan-Hung Chen, Tsung-Yuan Chen, Ryan Lu, Victor Liang, Kuo-Ji Chen, Kejun Xia

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2019

A Novel Constant E-Field Methodology for Intrinsic TDDB Lifetime Projection.

A. S. Teng, C. W. Lin, M. N. Chang, Aaron Wang, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Comprehensive device and product level reliability studies on advanced CMOS technologies featuring 7nm high-k metal gate FinFET transistors.

D. S. Huang, J. H. Lee, Y. S. Tsai, Y. F. Wang, Y. S. Huang, C. K. Lin, Ryan Lu, Jun He

Proceedings of the IEEE International Reliability Physics Symposium, 2018

The physical mechanism investigation of off-state drain bias TDDB and its implication in advance HK/MG FinFETs.

I. K. Chen, S. C. Chen, S. Mukhopadhyay, D. S. Huang, J. H. Lee, Y. S. Tsai, Ryan Lu, Jun He

Proceedings of the IEEE International Reliability Physics Symposium, 2018