S. C. Hu

According to our database, S. C. Hu authored at least 3 papers between 1998 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.

Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2016

2015

Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.

Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2015

1998

Design and analysis of delay control for CBR services in ATM networks.

Y. C. Chen, C. T. Chan, S. C. Hu

Comput. Commun., 1998