C. H. Lin

According to our database, C. H. Lin authored at least 7 papers between 2003 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Sub-ns Access Sub-mW/GHz 32 Kb SRAM with 0.45 V Cross-Point-5T Cell and Built-in Y_ Line.

C. Y. He, K. H. Tang, T. S. Chen, K. Y. Chang, C. H. Lin, K. Sato, Shyh-Jye Jou, P. H. Chen, H. M. Chen, B. D. Rong, K. Itoh

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2019

2017

Transformer management system for energy control of customer demand response and PV systems.

T. T. Ku, Chao Shun Chen, C. H. Lin, Cheng Ting Hsu

Proceedings of the 2017 IEEE Industry Applications Society Annual Meeting, 2017

2016

Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.

Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2016

Mitigation of voltage variation by REMS for distribution feeders.

C. C. Yeh, Chao Shun Chen, T. T. Ku, C. H. Lin, Cheng Ting Hsu, Hui-Jen Chuang

Proceedings of the 2016 IEEE Industry Applications Society Annual Meeting, 2016

2015

Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.

Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu

Microelectron. Reliab., 2015

Study of sub-5 nm RRAM, tunneling selector and selector less device.

Kai-Shin Li, Ming-Taou Lee, Min-Cheng Chen, Cho-Lun Hsu, J. M. Lu, C. H. Lin, C. C. Chen, B. W. Wu, Y. F. Hou, C. Yi. Lin, Y. J. Chen, T. Y. Lai, M. Y. Li, I. Yang, C. S. Wu, Fu-Liang Yang, W. K. Yeh

Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

2003

Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability.

D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu

Microelectron. Reliab., 2003