S. Nishizawa

According to our database1, S. Nishizawa authored at least 1 paper in 2013.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2013
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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