Tomohiro Shimizu

According to our database1, Tomohiro Shimizu authored at least 13 papers between 2010 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2021
Hand Motion-Aware Surgical Tool Localization and Classification from an Egocentric Camera.
J. Imaging, 2021

2020
Surgery Recording without Occlusions by Multi-view Surgical Videos.
Proceedings of the 15th International Joint Conference on Computer Vision, 2020

Development of a Person Search Components Based on an Omnidirectional Camera and a 3D-LiDAR.
Proceedings of the 59th Annual Conference of the Society of Instrument and Control Engineers of Japan, 2020

Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings.
Proceedings of the Medical Image Computing and Computer Assisted Intervention - MICCAI 2020, 2020

2019
Prediction of Future Shot Direction using Pose and Position of Tennis Player.
Proceedings of the Proceedings Proceedings of the 2nd International Workshop on Multimedia Content Analysis in Sports, 2019

Automatic Viewpoint Switching for Multi-view Surgical Videos.
Proceedings of the IEEE International Symposium on Mixed and Augmented Reality, 2019

Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Study of MacEtch using Additives for Preparation of TSV.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018
Toward Automatic Tuning of Tendon-driven Mechanisms: Vibration based Detection of Tendon Tension.
Proceedings of the IEEE International Conference on Intelligence and Safety for Robotics, 2018

2015
All-wet TSV filling with highly adhesive displacement plated Cu seed layer.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
Low temperature through-Si via fabrication using electroless deposition.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


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