Shoso Shingubara

According to our database, Shoso Shingubara authored at least 5 papers between 2010 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Study of MacEtch using Additives for Preparation of TSV.

Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

All-wet TSV filling with highly adhesive displacement plated Cu seed layer.

Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.

S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Low temperature through-Si via fabrication using electroless deposition.

Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers.

Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara

Proceedings of the IEEE International Conference on 3D System Integration, 2010