Se Young Yang

According to our database, Se Young Yang authored at least 3 papers between 2006 and 2012.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2012

Chip warpage model for reliability prediction of delamination failures.

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee

Microelectron. Reliab., 2012

2006

Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition.

Se Young Yang, Wang-Joo Lee, S. H. Jeong, S. J. Lee

Microelectron. Reliab., 2006

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.

Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik

Microelectron. Reliab., 2006