Woon-Seong Kwon

According to our database, Woon-Seong Kwon authored at least 2 papers between 2006 and 2012.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2012

Chip warpage model for reliability prediction of delamination failures.

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee

Microelectron. Reliab., 2012

2006

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study.

Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik

Microelectron. Reliab., 2006