Shan-Chun Yang

According to our database, Shan-Chun Yang authored at least 2 papers between 2015 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

The influence of device morphology on wafer-level bonding with polymer-coated layer.

Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration.

Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen

Proceedings of the 2015 International 3D Systems Integration Conference, 2015