Kuan-Neng Chen
Orcid: 0000-0003-4316-0007
According to our database1,
Kuan-Neng Chen
authored at least 36 papers
between 2002 and 2022.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2018, "For contributions to 3D integrated circuit and packaging technologies".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
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on orcid.org
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Bibliography
2022
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2019
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2017
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes.
IEEE Trans. Biomed. Circuits Syst., 2017
An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017
2016
An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016
Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications.
IEEE Trans. Biomed. Circuits Syst., 2014
Energy-efficient low-noise 16-channel analog-front-end circuit for bio-potential acquisition.
Proceedings of the Technical Papers of 2014 International Symposium on VLSI Design, 2014
18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014
Energy-efficient configurable discrete wavelet transform for neural sensing applications.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014
2013
Through-silicon-via-based double-side integrated microsystem for neural sensing applications.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013
Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications.
Proceedings of the 2013 IEEE Biomedical Circuits and Systems Conference (BioCAS), Rotterdam, The Netherlands, October 31, 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
Proceedings of the IEEE 25th International SOC Conference, 2012
2011
Integration schemes and enabling technologies for three-dimensional integrated circuits.
IET Comput. Digit. Tech., 2011
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Microelectron. Reliab., 2010
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network.
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010
2008
2005
2004
Technology, performance, and computer-aided design of three-dimensional integrated circuits.
Proceedings of the 2004 International Symposium on Physical Design, 2004
2002
Proceedings of the 3rd International Symposium on Quality of Electronic Design, 2002