Sheng-Jye Hwang

According to our database, Sheng-Jye Hwang authored at least 5 papers between 2004 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Accurate numerical simulations of capillary underfill process for flip-chip packages.

Yu-Chi Cheng, Yu-Hsien Chen, Hao-Hsi Hung, Sheng-Jye Hwang, Dao-Long Chen, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hung

Eng. Comput., December, 2025

2017

Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis.

Kuo-Tsai Wu, Sheng-Jye Hwang, Huei-Huang Lee

Sensors, 2017

Finite Element Analysis of Film Stack Architecture for Complementary Metal-Oxide-Semiconductor Image Sensors.

Kuo-Tsai Wu, Sheng-Jye Hwang, Huei-Huang Lee

Sensors, 2017

2007

Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method.

Shiang-Yu Teng, Sheng-Jye Hwang

Microelectron. Reliab., 2007

2004

Temperature prediction of rolling tires by computer simulation.

Yeong-Jyh Lin, Sheng-Jye Hwang

Math. Comput. Simul., 2004