Dao-Long Chen

According to our database, Dao-Long Chen authored at least 6 papers between 1996 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Accurate numerical simulations of capillary underfill process for flip-chip packages.

Yu-Chi Cheng, Yu-Hsien Chen, Hao-Hsi Hung, Sheng-Jye Hwang, Dao-Long Chen, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hung

Eng. Comput., December, 2025

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging.

Ian Hu, Tzu-Chun Hung, Mu-Heng Zhou, Heng-Sheng Lin, Dao-Long Chen

Comput. Mater. Continua, 2025

2015

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.

Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai

Microelectron. Reliab., 2015

Thermal resistance of side by side multi-chip package: Thermal mode analysis.

Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2015

2012

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation.

Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2012

1996

A power and area efficient CMOS clock/data recovery circuit for high-speed serial interfaces.

Dao-Long Chen

IEEE J. Solid State Circuits, 1996